Address questions to Dieter Bergman <[log in to unmask]> or Jeanne Cooney <[log in to unmask]>.
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Minutes of Optoelectronics Strategy Meeting
JDS Uniphase
Melbourne, FL September 20-21, 2001
Industry representatives interested in the direction taken on standards regarding optoelectronic assembly met at the facilities of JDS Uniphase on September 20 and 21, 2001. The purpose of the meeting was to develop a strategy as to what standards are needed in order to encourage building the infrastructure for producing optoelectronic assemblies.
The meeting was organized after the IPC International Conference on Optoelectronics that took place in Toronto, Ontario, Canada on May 3-4, 2001. During that conference many characteristics about optoelectronic manufacturing were discussed. In addition the breakout sessions clearly identified that standards were needed if the technology were to become a manufacturing reality. The following comments were recorded from the Toronto conference.
1) The group consisted of 14 individuals who were all interested in moving ahead on the development of useful standards. The intent of the standards should be to avoid unnecessary confusion in the industry.
2) It appears that although there is a lot of activity everyone is doing something different. Individuals involved in producing product, using this technology, report that each customer has their own solution. Similar products are requested by the customers that are different by slight variations for apparently no reason.
3) A discussion took place as to whether the IPC, representing the Surface Mount Council, was the right group to facilitate the standardization effort. Bergman explained that the model developed for the J-STD-012 worked well to address standards needed for Flip Chip and Chip Scale Technology Implementation. He proposed using that technique to involve other associations who have interests in Optoelectronics.
4) Two concerns were expressed on how to involve the large companies, and other organizations who have an interest and are responsible for standardization in the subject of Optoelectronics. Attendees agreed that they would provide the names of individuals and companies who should be made aware of the standardization effort.
5) The J-STD-012 cover shows the logos of organizations involved in the development; these were JEDEC, EIA, IPC, MCNC, and Sematech. The broad experience of the participants made the J-STD-012 a good document, which provided a history, identification of requirements and a list of standards that needed to be developed. Standards that evolved from the J-STD-012 include IPC standards, Joint standards, JEDEC standards.
6) A preliminary date was set for the first strategy meeting. That date is September 20th and 21st. Paul Magill, JDS Uniphase offered to host the first meeting in Melbourne, Florida. Paul did the same for the first meeting of the J-STD-012 at MCNC, so he is well aware of the challenges.
7) In order to identify and promote this first activity, Bergman indicated that he would discuss the subject at the upcoming JIC (Jisso International Council) meeting in Okinawa on May 14th and 15th. After that meeting he will develop a potential press release to let people know that the effort will be started in September. The preliminary press release will be reviewed by the attendees of the breakout session.
All of the suggestions from the Toronto meeting came to pass. Many individuals had planned to attend the first strategy meeting. With the events that took place in the US on September, 11 there were quite a few cancellations, never-the-less it was decided to start the activity rather than delay this important effort. Those individuals who expressed an interest would receive copies of what transpired so that they could participate and contribute in future meetings.
The following individuals were in attendance at the first strategy meeting:
Randall R. Robertson, C-MAC Industries
J.Terrence Montonye, SPIE (Society of Optical Engineering)
Vernon Price, JDS Uniphase Corporation
Brian Pate, Palomar Technologies
Marty Rodriguez, Jabil Circuit Technology Services
Dr. Katsuji Takasu, Siemens Electronics Assembly Systems
Paul Magill, JDS Uniphase Corporation
Mel Parrish, Soldering Technology International
Reza Ghaffarian, JPL
Ed Palmer, JDS Uniphase Corporation
Dieter Bergman, IPC
Introduction
The attendees reviewed the activities of the Toronto Conference. Bergman repeated the presentation that he gave at the conference on International Standards and how the industry could develop a strategy on a new topic. The presentation highlighted the development of a joint standard that could be used to define the detailed standards needed to make optoelectronic assembly a clearly defined concept. See Appendix A for the written text of the presentation.
The attendees felt that it was important to develop a scope and purpose for the activity. The following were the agreed to strategy for a joint standard. Everyone recognized that this preliminary document would not really be a standard; rather it becomes a roadmap of the information on opt electronics and defines the detailed standards that are necessary. The Scope and Purpose were agreed to be:
1 SCOPE
This document addresses the implementation of optical and optoelectronic packaging technologies.
The areas discussed include: technology choices, design considerations, material properties, component mounting and interconnecting structures, assembly processes, testing, application, rework, and reliability of completed optoelectronic assemblies. Optoelectronic packaging technologies include active and passive components and discrete fiber cable, their characteristics, and the manner that these parts will become an integral part of the functioning module, board or sub-assembly.
1.1 Purpose
This document is intended to provide general information on implementing optical and optoelectronic technologies, for creating component mounting structures and assemblies that may be exclusively optically oriented or that are to perform a combination of optical and electronic functions.
Project status
A title number was defined for the new document. The number is J-STD-040. The title for the document is: Optoelectronic Assembly and Packaging Technology
The attendees discussed a possible outline for the new document. A tentative outline was established. this outline followed the J-STD-012 format and included:
1.0 Scope
2.0 Technology Overview
3.0 Applications for Optoelectronics
4.0 Design Considerations
5.0 Material properties and processes
6.0 Mounting and Interconnecting structures
7.0 Assembly Processes
8.0 Testing procedures (Accelerated testing)
9.0 Reliability requirements
10.0 Standardization
11.0 Future Needs
A discussion took place regarding some standards already in place in the industry. These are developed for the Telecommunications industry and are known as "Telcordia" standards. Since these are the only standards available they get invoked quite frequently even for environments that do not the stringent requirements of a forty year life expectation. The attendees felt that less severe requirements could be documented that reduced the amount of testing presently contained in the "Telcordia" standards.
The attendees defined what standards were needed for the future of optoelectronics. A Scope and Purpose was developed for each of the proposed standards. A total of twenty-two standards were defined by the group. These included:
10.1 Fiber arrangement and routing
10.2 Fiber splicing and test
10.3 Handling of photonic components and fiber optic cable
10.4 Connector socket design and assembly
10.5 Optical Power loss budget requirements
10.6 Optical fiber identification or coding systems
10.7 Optoelectronic coupling design for long term reliability
10.8 Hermetic control for Optoelectronic packaging
10.9 Quality Assurance of Optoelectronic components and Assemblies
10.10 Cleaning and cleanliness/contamination testing
10.11 Moisture absorption precautions for optoelectronic packages
10.12 Optoelectronic thermo-mechanical engineering requirements
10.13 Material requirements for optical interconnecting substrates
10.14 Optical board interconnection performance requirements
10.15 Attachment materials for optoelectronic assembly
10.16 Design requirements for optoelectronic assemblies
10.17 Configuration management of optoelectronic assemblies
10.18 Methods for optoelectronic component attachment and alignment
10.19 Heterogeneous optoelectronic assembly requirements
10.20 Tools and procedures for optoelectronic assembly and repair
10.21 Test methods for optoelectronic components
10.22 Test methods for optoelectronic assembly verification
A preliminary draft was developed for the J-STD-040. This draft is primarily a skeleton which will be built upon in the coming months.
Schedule for Future Activities
The group discussed the various meetings that needed to be planned in order to achieve the goals of this program. Bergman was asked to send out minutes and coordinated the activities that would include other organizational participation.
The following schedule was suggested.
September 23rd, Send Prelim. minutes and opto standards presentation to attendees of first meeting
September 26th, Send Minutes of Meeting to all. Do meeting announcement for Orlando
October 1-4, Fiber optic automation Expo, Rosemont Chicago
October 3rd, All input to Dieter to be included in first working draft
October 4th, Email first working draft to all interested parties. Include Orlando Participants
October 13, Orlando Meeting to develop 2nd Working draft of standard
October 19, Send second draft of document to participants
October 22, 23, Two day working meeting, IPC HQ
November 15, Email third working draft to participants
November 20, Conference call 11:00 AM eastern Std Time
December 3, All input sent to IPC as result of conference call
December 27, Fourth Draft of document sent to all
2002
January 10, Comments received on fourth working draft
January 21, Working meeting at APEX, San Diego
January 23, Photonic Manufacturing and Automation Forum part of SPIE' s photonics West San Jose
February 13,14,15, Completion of Proposal for Industry Review Define those standards that can be started - Fiesta Inn, Tempe Arizona
Although several of the dates need to be reconfirmed, the group felt it was important to have some preliminary description of when the groups could meet in joint session and have those dates identified for consideration by the participants
Everyone had felt that a great deal had been accomplished and looked forward to the standardization project of optoelectronics assembly
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