Just to keep the spec tree straight---

MIL-D-275 became IPC-D-275 became 2220 series with 2221/2222 covering rigid board design

IPC-RB-276 was a "performance" standard replaced by the 6010 series with 6011/6012 together covering the rigid board performance (build acceptance) criteria for rigid boards; IPC-A-600 provides corresponding visual criteria.

For assembly IPC/EIA J-STD-001C provides material and process requirements; IPC-A-610C provides visual acceptance requirements. IPC-HDBK-001 provides a comparision between J-STD-001B and C and lots of good discussion on why/how to understand and use J-001.  A similar handbook is being developed for A-610.

Hope this helps.
Jack

>>> [log in to unmask] 09/26/01 11:32AM >>>
Paul, others will likely contribute, but I can't help expressing amusement
that the relatively new (2 years or so old) IPC-2221, is referenced in a
drawing along with what looks like the antique (cancelled 8 or so years
ago) IPC ML-950.  My recollection is that IPC RB-276 replaced 950, and has
in turn been replaced by 2221.  Lou Hart

-----Original Message-----
From:   Paul Truit [SMTP:[log in to unmask]] 
Sent:   Wednesday, September 26, 2001 10:25 AM
To:     [log in to unmask] 
Subject:        [TN] Specifications

I have recieved an assembly drawing the includes a note:

"Printed Wiring Board Assembly shall be in accordance with IPC-2221 and
ANSI/IPC-Mil-950 Class 2"

IPC-2221 looks to me that it is for the board design and is not
applicable to assembly specifications.  I can't find any information for
the ANSI/IPC-Mil-950 Class 2.

Can someone give me the specifics about these specifications?  Can
IPC-A-610 Rev C class 2 be used as an equivalent exception?

Thank You

--
Paul Truit, Mfg. Eng.
RBB Systems, Inc.
4265C E. Lincolnway
Wooster, OH  44691
Ph. (330) 567-2906 ext 514
Fax (330) 263-5324
Email: [log in to unmask] 

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