Good morning,

     I am in the middle of a slight disagreement between a couple of our company's organizations. It is over stacking
SMD chips, specifically 0603s. In a temporary rework fix engineering wants to stack and solder one chip directly on top of the other. Does anyone have any experience positive or negative concerning this practice?

Tim DeVaul
Quality Assurance Training and Audit Supervisor
Philips Broadband Networks, Inc.
100 Fairgrounds Dr.
Manlius, New York 13104
Tel: (315) 682-9105 Ext. 2403
Fax: (315)682-9006
Email: [log in to unmask]

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