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September 2001

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Subject:
From:
"Busko, Wolfgang" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 26 Sep 2001 14:26:54 +0200
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Hi Rob,

if itīs only the toe that you have a problem with your problem might be the
lead itself. Look at those parts before you put them on the board and I bet
you will see that thereīs no solderable surface visible at the toe like on
the rest of the lead due to cutting the leads after applying the solderable
surface to the leads.
Thatīs not a point to worry as long as your solderjoints especially the
healfillet are what they should be.
Itīs than just to be considered a cosmetical issue that sometimes isnīt
noticed due to excessive solder that only hides this spot.

Wolfgang
 

-----Ursprüngliche Nachricht-----
Von: Rob Day [mailto:[log in to unmask]]
Gesendet am: Mittwoch, 26. September 2001 14:09
An: [log in to unmask]
Betreff: [TN] solder reflow question

Hello folks,

We have a problem with some IC's and solder quality on a board that we are
running.  The inspector told me we had problems with the toe solder joints.
The reflow throughout the rest of the board looks pretty good.  This solder
problem around the IC is not a consistent one. The solder is not rejectable,
but we would like it to look better.

I have tested our profile with some profiling tools and the profile is very
good.  Our paste is only 1 day old.  Could it be some of the pads on the raw
board?

Is there anything else that you folks would check as part of a typical
problem solving approach as I am relatively new to the industry.

Your comments would be greatly appreciated.


Thanks,

rob day

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