IPC-A-610 does state that a depression of 25% is acceptable. there for on
the top/primary side of the assembly it is not required to have solder on
the land. Also you only need to have
180 degrees of wetting on the top/primary side for class 2 assemblies
between the lead and the barrel as long as you have 270 degrees
of solder wetting on the bottom side with the land on the secondary side
having at least 75% solder coverage for class 1,2 & 3.
This depression that I speak of can be 12.5% on the secondary and 12.5% on
the primary side to combine for 25%. Or 25% on the Primary side.

Barry Gallegos
Process Engineer
IPC-1-610 Class A Instructor.
Western Electronics
1550 South Tech Lane
Meridian, Idaho 83642
Phone: 208/955-9771
Fax: 208/955-9755

-----Original Message-----
From: Guy Ramsey [mailto:[log in to unmask]]
Sent: Monday, September 24, 2001 4:07 PM
To: [log in to unmask]
Subject: Re: [TN] Insufficient solder


Sounds acceptable. There must be evidence of wetting to the barrel as well.
No solder is required on the land. But caution is in order. Can you perform
a test like J-STD-003 4.2.4 Wave Solder Test?

Guy Ramsey
Senior Lab Technician / Instructor


E-Mail: [log in to unmask] <mailto:[log in to unmask]>
Ph: (610) 362-1200 x107
Fax: (610) 362-1290



-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Peter Crain
Sent: Monday, September 24, 2001 5:13 PM
To: [log in to unmask]
Subject: [TN] Insufficient solder


I need to nail down what an insufficient solder defect is. We are dealing
with through components.

We are seeing good solder fillets on the component side. But, there is a
concave dip 360 degrees around the lead of the secondary side of the
board. - (the solder doesn't fill completely to the top to be level with
the board.) There is a small fillet that goes around the lead 360 degrees.
This is not illistrated in IPC-A-610 wheater is it a defect. Would anyone
else consider this a defect?

Can anyone help clarify?

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