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September 2001

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Subject:
From:
Nancy Trumbull <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 25 Sep 2001 08:41:41 -0400
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Peter,

  Good Morning to you,
  If I understand you right you want to know if you can have a depression on the secondary side of the board.

Please look at page 6-6 in your IPC 610C  
Acceptable Class
* Minimum 75% fill.  A total maximum of 25% depression including both secondary and primary sides is permitted

Also you will need to meet  Table  6-2 on page 6-5 

Basally you need a 75% fill with no more than a 25% depression on one given side.

Hope this helped
Have a good day
Nancy T.

>>> [log in to unmask] 09/24/01 05:12PM >>>
I need to nail down what an insufficient solder defect is. We are dealing
with through components.

We are seeing good solder fillets on the component side. But, there is a
concave dip 360 degrees around the lead of the secondary side of the
board. - (the solder doesn't fill completely to the top to be level with
the board.) There is a small fillet that goes around the lead 360 degrees.
This is not illistrated in IPC-A-610 wheater is it a defect. Would anyone
else consider this a defect?

Can anyone help clarify?

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