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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 25 Sep 2001 08:41:41 -0400 |
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Peter,
Good Morning to you,
If I understand you right you want to know if you can have a depression on the secondary side of the board.
Please look at page 6-6 in your IPC 610C
Acceptable Class
* Minimum 75% fill. A total maximum of 25% depression including both secondary and primary sides is permitted
Also you will need to meet Table 6-2 on page 6-5
Basally you need a 75% fill with no more than a 25% depression on one given side.
Hope this helped
Have a good day
Nancy T.
>>> [log in to unmask] 09/24/01 05:12PM >>>
I need to nail down what an insufficient solder defect is. We are dealing
with through components.
We are seeing good solder fillets on the component side. But, there is a
concave dip 360 degrees around the lead of the secondary side of the
board. - (the solder doesn't fill completely to the top to be level with
the board.) There is a small fillet that goes around the lead 360 degrees.
This is not illistrated in IPC-A-610 wheater is it a defect. Would anyone
else consider this a defect?
Can anyone help clarify?
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