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September 2001

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Subject:
From:
Alain Savard <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 25 Sep 2001 07:31:09 -0400
Content-Type:
text/plain
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text/plain (47 lines)
Hi Neil,

In IPC-6012A, page 9 table 3-6, states that "Separation along the vertical
edge of external land(s)" is "Allowed (See figure 3-3) provided it does not
extend beyond the vertical edge of the external copper foil."

I think that would mean that this is acceptable.

Alain Savard, B.Sc.
QA-PCB
CAE Inc.

-----Original Message-----
From: Neil Atkinson [mailto:[log in to unmask]]
Sent: September 25, 2001 6:03 AM
To: [log in to unmask]
Subject: [TN] Microsection


I have some microsections of some DSPTH boards made by one of our suppliers
which show smearing on the vertical side of the outer copper layer.

Figure 3.2 of IPC6012 (page 12) shows the condition.  Having read IPC-6012
and IPC600 I am confused as to the acceptability of this.  I would
appreciate any comments or an offer from someone for me to send them
microsection photographs by e-mail direct (I understand the TechNet
automatically removes attachments.

Thanks,

Neil


Neil Atkinson - Quality Manager
Stadium Electronic Controls Division
Stephen House, Brenda Road, Hartlepool TS25 2BQ

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