I need to nail down what an insufficient solder defect is. We are dealing
with through components.

We are seeing good solder fillets on the component side. But, there is a
concave dip 360 degrees around the lead of the secondary side of the
board. - (the solder doesn't fill completely to the top to be level with
the board.) There is a small fillet that goes around the lead 360 degrees.
This is not illistrated in IPC-A-610 wheater is it a defect. Would anyone
else consider this a defect?

Can anyone help clarify?

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