Shirely  as per the tm-650 , the difference is clearly defined between if
tested with copper foil still on the circuit or if the test is performed in
an area that has has the foil removed. It does not ref single or double
sided. My point was why the tm-650 group highlighted this difference for
DSC but no mention is made for testing by DMA.

Regards

-----Original Message-----
From:   Shirley Xiao [SMTP:[log in to unmask]]
Sent:   Thursday, September 20, 2001 8:19 PM
To:     [log in to unmask]
Subject:        Re: [TN] Tg measurements by DMA

I guess you missunderstood the TM-650. I think the
difference is between double sided and single sided or
even unclad board right after press by laminator.
There is no big difference if compare a double sided
board with clad and withou copper foil by etching.




--- Gerard O'Brien <[log in to unmask]> wrote:
> When testing Tg with DSC, the TM-650 test method
> calls out for the test to
> be run with the copper clad still attached and that
> if removed to expect an
> 8 to 15 degree reduction in values. For DMA it does
> not reference testing
> with copper clad or removed. Can anyone give me the
> reason why?
>
> Regards
>
> Gerard O'Brien
>
>
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