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Subject:	Re: External conductor starting thickness before platiing and MIL qualification
From:	Earl Moon <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Fri, 21 Sep 2001 08:17:09 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (41 lines)

Michael and Shirley

I think you've covered everything I wanted to know and other PCB types need
to know as well as reviving my thoughts about everything I forgot. Much good
stuff in addition to Shirley's talking to foil thickness before and after
processing. This can be important for us all and especially for those using
very high speed RF stuff.

Hope you don't mind but I'm going to put some of the stuff I forgot or plain
didn't know into my soon to be dusted off presentation for use in my new
military jobs adventures. Didn't think I'd be doing this again any time
soon.

As for MIL qualification, I've been updating on that as well. The points
several people brought up are important especially those concerning QPL and
QML. This one's got me a bit nervous but I think Susan got that right - ask
an independent test lab for a starting point. You're going to need a lab as
part of the process and they know all the players and specified
requirements.

The rest is up to those good enough to REALLY manage their processes as the
qual process, especially at the lab, is very unforgiving if you miss but one
test requirement (all the things listed in group A and B testing in 55110
and or 6012). It isn't easy to get qualified, especially the first time and
that takes time, and it's very expensive especially if you have to do it
over, but a benefit is becoming a much better board shop.

Earl Moon

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