Core thicknesses down to 3 and even 2 mils are available.  The 2 core is
specifically designed to accomplish what you want.  The copper foil is
flipped to avoid tooth-to-tooth issues.  The material is also tested prior
to use to verify there are no potential reliability issues due to
contamination, etc.

There are also a lot of work being done on the next generation of embedded
passive components.  One such project is the NCMS Advanced Embedded Passives
Technology project.  You can find out more at  http://aept.ncms.org/  .

Thanks for the plug, Earl.


> ----------
> From:         Jack Crawford[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.
> Sent:         Wednesday, September 19, 2001 9:19 AM
> To:   [log in to unmask]
> Subject:      Re: [TN] Plane Capacitor Board Construction
>
> >>> "Brooks,Bill" <[log in to unmask]> 09/19/01 10:23AM >>>
>
> I attended one of Rick Hartley's seminars at PCB West in Santa Clara, CA.
> a
> while back... He talked of creating a board stackup with the power and
> ground planes very close together in the inner core of the material...
> thus
> creating a bypassing capacitive effect for High speed logic boards. The
> distance specified was like 2 to 3 mils apart. How would you go about
> constructing a board with this feature in it? I have had a board
> manufacturer tell me that 'the board would warp with all that prepreg in
> it'... and the smallest core he had was 5 mil, could not get 3 mil. Is
> this
> just a stackup configuration problem or is there more to it? Comments
> welcome... :)
>
> Bill Brooks
> PCB Design Engineer , C.I.D.
> DATRON WORLD COMMUNICATIONS, INC
> 3030 Enterprise Court
> Vista, CA 92083
> Tel: (760)597-1500 Ext 3772 Fax: (760)597-1510
> mailto:[log in to unmask]
> IPC Designers Council, San Diego Chapter
> http://www.ipc.org/SanDiego/
> http://home.fda.net/bbrooks/pca/pca.htm
>
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