>>> Earl Moon <[log in to unmask]> 09/19/01 12:24PM >>>

Damn,

Real PCB fab questions. Can this be real. Wish I could remember all I
forgot.

Simple answer is it depends on the processes used to prep surfaces for
subsequent imaging, plating, and etching processes. The thinner the copper
foil, the more chance for the conductor pattern going away - actually never
having had a chance to be created.

Man, never worked with 1/8 oz foil. Worked some with 1/4 and lots with 1/2,
as pretty standard stuff. 1 oz too thick for fine line applications. It's
all a compromize. As a concurrent engineering design type, you need to know
your board shop's process engineering capabilities and how much copper will
be removed before initiating a design. Lot's more but just can't or won't
think about it now.

MoonMan

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