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September 2001

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Subject:
From:
Jack Crawford <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 19 Sep 2001 12:00:41 -0500
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>>> <[log in to unmask]> 09/19/01 10:52AM >>>

The Isol laminates web site has a few paper on this issue.
http://www.isolalaminatesystems.com/technical/techpapers/index.htm 
IF anyone has additional info I would also be interested as well.




Jack Crawford <[log in to unmask]>@IPC.ORG> on 09/18/2001 12:16:55 PM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>

Sent by:  TechNet <[log in to unmask]>


To:   [log in to unmask] 
cc:

Subject:  Re: [TN] Via Reliability and Thermal Shock


>>> "Buscomb, Scott" <[log in to unmask]> 09/18/01 11:10AM >>>

I am looking for research on via reliability under thermal shock. I am
particularly interested in drilled via (>200um). Is anyone aware of any
papers, studies, etc?
Thanks in advance,

Scott Buscomb
PCB Design Engineer
Zight Corporation
www.zight.com 

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