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September 2001

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Subject:
From:
Jack Crawford <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 19 Sep 2001 11:52:48 -0500
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>>> "May William D (Dean) CNIN" <[log in to unmask]> 09/19/01 11:17AM >>>

Reading from IPC-6012A, I noticed the required starting thickness of an
external conductor prior to plating for 1/8 oz base copper foil is 0.00020
inches and the starting thickness for 1/2 oz base copper is 0.00067 inches.
Does anyone have an idea on how minimum starting thickness is determined for
each weight of base copper?  If minimum base thickness is exceeded by
chemical milling and micro-etching processes, will it compromise board
reliability assuming that there is sufficient electroplated copper to meet
minimum total finished copper thickness? What possible problems may arise if
these base minimums are exceeded?

Thanks for your consideration!

Ed McAtee
NAVSURFWARCEN
PHONE 812-854-3892
FAX 812-854-1174

 
 

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