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September 2001

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Subject:
From:
Jack Crawford <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 18 Sep 2001 15:39:06 -0500
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>>> <[log in to unmask]> 09/18/01 02:57PM >>>

Peter,

Insufficient solder - one problem, many solutions:
Process: solder temp (too high or too low), solder wave (low or not
parallel), preheat temp (too high or too low), flux (dirty, s.g. too low or
too high, contaminated, low foamhead, not active), conveyor speed (too fast
or too slow), fixture problems.
Assembly: contamination (board or component)
Board Fab: oxidized, contaminated, mask in holes
Design: lead-to-hole ratio (too large or too small), large groundplane(s)

This is not a complete list - just a partial from a wave solder
problem/solution matrix that I was given ten plus years ago.

What you need to share with technet are your current process parameters,
your temperature profile, board size, thickness, flux type, etc.

Good luck,

Al Kreplick
Sr. Mfg. Eng.
Teradyne, Inc.
978-370-1726




 (Embedded
 image moved   TechNet <[log in to unmask]>
 to file:      09/18/2001 02:20 PM
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Please respond to "TechNet E-Mail Forum." <[log in to unmask]>

To:   [log in to unmask] 
cc:
Subject:  [TN] Insufficient solder, spray fluxer


>>> Peter Crain <[log in to unmask]> 09/18/01 12:55PM >>>

I am having troubles with insufficient solder coming from wave solder
machine.

First, what variables tend to cause this defect?

Second, we have a base model wave solder with a foam fluxer. I am thinking
of purchasing a spray fluxer for our machine to help reduce this defect.
Would this greatly reduce defects from the wave machine?

I am new engineer in the electronic manufacturing world so please take it
easy on me if my questions are too broad and simple.

Peter Crain
GE Harris
Calgary, Alberta, Canada

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