>>> "Buscomb, Scott" <[log in to unmask]> 09/18/01 11:10AM >>>
I am looking for research on via reliability under thermal shock. I am
particularly interested in drilled via (>200um). Is anyone aware of any
papers, studies, etc?
Thanks in advance,
Scott Buscomb
PCB Design Engineer
Zight Corporation
www.zight.com
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