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September 2001

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From:
Jack Crawford <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 18 Sep 2001 09:37:03 -0500
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>>> "Dean Lillibridge" <[log in to unmask]> 09/18/01 07:49AM >>>

TEKA INTERCONNECTION SYSTEMS was one of the pioneers of solder-flux beearing
lead technology.  (www.tekais.com).  Great documentation and sample request
fulfillment when I checked into this a few years ago.  Since then
Samtec,Advanced interconnections, Mill-Max, and others have begun to offer
through-hole connectors with solder bearing leads that liquify during
typical reflow processing of printed circuit boards.  This technology is
also often called, "INTRUSIVE SOLDERING" or ,"pin in hole intrusive reflow
(PIHIR).  CIRCUIT ASSEMBLY magazine had a good article on "Using Solder
Preforms for Higher Productivity" in April 2000 issue written by Mitch
Holtzer.  I can send this article along with some of my other info that I
collected on the topic if you contact me off-line.   Hope it helps.
                                                        Dean Lillibridge
                                                        NEWvENTURE TECHNOLOGIES
                                                        1-800-900-4699 EXT 7057
                                                        ([log in to unmask])
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