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September 2001

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Subject:
From:
Jon Moore <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 4 Sep 2001 13:31:07 EDT
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There are advantages to both positions in the line.  If you place the AOI
system before reflow, then you can accurately measure the capability of your
pick & place equipment.  Since some of the components will self-center during
reflow you lose that capability by placing the system after the oven.
However, you do gain the ability to look for gross solder defects by placing
AOI post-reflow.  My opinion is that the very best setup is to have
high-speed paste measurement after printing, capable of measuring every pad
printed on every board, followed by AOI after pick & place, and then add in a
profiler for the oven that gives you a real-time profile for every board, 24
hours/day.  That combination covers all of the critical parameters for the
line without causing a bottleneck and without resorting to sample inspections.

Jon Moore

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