If possible, I would also like a copy.
Thanks,
yves
Yves Dupuis
Process Engineering
Leitch Technology
Phone: 416-445-9929 X3389 / Fax: 416-445-7927
25 Dyas Road, North York, Ontario M3B 1V7
> -----Original Message-----
> From: Grant Emandien [SMTP:[log in to unmask]]
> Sent: Thursday, September 13, 2001 8:32 AM
> To: [log in to unmask]
> Subject: Re: [TN] No-Clean Solder Paste
>
> If this does not infringe any copyrights, please copy me as well.
>
> Thanks Doug
> Grant
>
> -----Original Message-----
> From: Bartkowaik Christine [mailto:[log in to unmask]]
> Sent: Thursday, September 13, 2001 1:36 PM
> To: [log in to unmask]
> Subject: Re: [TN] No-Clean Solder Paste
>
>
> Doug:
>
> I would appreciate a copy.
>
> -----Original Message-----
> From: [log in to unmask]
> [SMTP:[log in to unmask]]
> Sent: Wednesday, September 12, 2001 3:47 PM
> To: [log in to unmask]
> Subject: Re: [TN] No-Clean Solder Paste
>
> Chris,
> I don't know if there is a good pro and con list for no-clean
> assembly.
> You can look at IPC-TP-1115 "Selection and Implementation Strategy
> for a
> Low Residue No-Clean Process" for a good list of things to
> consider
> in such
> a switch. I can send it to you if you like.
>
> Doug Pauls
> Rockwell Collins
>
>
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