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September 2001

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Subject:
From:
Guy Ramsey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 13 Sep 2001 14:19:56 -0400
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That would be found in J-STD-001. 006 is for new alloy bar and wire

Guy Ramsey
Senior Lab Technician / Instructor


E-Mail: [log in to unmask] <mailto:[log in to unmask]>
Ph: (610) 362-1200 x107
Fax: (610) 362-1290



-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Mark Hargreaves
Sent: Thursday, September 13, 2001 2:01 PM
To: [log in to unmask]
Subject: [TN] HAL solder specs


Hi All,
Does J-STD-006 specify the allowable contaminant levels in my HAL solder
pot?
IPC-6012A sec3.2.6.4 (Solder Coating) points to J-STD-006.
J-STD-006 sec3.2 (Alloys) shows Cu @0.08% max, which seems VERY low.
( We're currently limiting to 0.3% max.).

Also: why are assembly solder pot standards (J-STD-001) Table 5-1 (Solder
Limits) more relaxed than HAL (J-STD-006)?

Thanks,
Mark

P.S. Thanks to all who responded to my previous HAL question.

P.S. Technet's a great forum: Scientific, but not clinical.  Focused and
knowledgeable. Occasionally emotional, but moderated.

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