Hi All,
Does J-STD-006 specify the allowable contaminant levels in my HAL solder
pot?
IPC-6012A sec3.2.6.4 (Solder Coating) points to J-STD-006.
J-STD-006 sec3.2 (Alloys) shows Cu @0.08% max, which seems VERY low.
( We're currently limiting to 0.3% max.).

Also: why are assembly solder pot standards (J-STD-001) Table 5-1 (Solder
Limits) more relaxed than HAL (J-STD-006)?

Thanks,
Mark

P.S. Thanks to all who responded to my previous HAL question.

P.S. Technet's a great forum: Scientific, but not clinical.  Focused and
knowledgeable. Occasionally emotional, but moderated.

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------