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September 2001

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Date:
Fri, 14 Sep 2001 01:55:28 +0800
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Hi Doug,

Me too.



Thanks,

Adam



-----Original Message-----

From: TechNet [mailto:[log in to unmask]]On Behalf Of Grant Emandien

Sent: Thursday, September 13, 2001 8:32 PM

To: [log in to unmask]

Subject: Re: [TN] No-Clean Solder Paste





If this does not infringe any copyrights, please copy me as well.



Thanks Doug

Grant



-----Original Message-----

From: Bartkowaik Christine [mailto:[log in to unmask]]

Sent: Thursday, September 13, 2001 1:36 PM

To: [log in to unmask]

Subject: Re: [TN] No-Clean Solder Paste





Doug:



I would appreciate a copy.



        -----Original Message-----

        From:   [log in to unmask]

[SMTP:[log in to unmask]]

        Sent:   Wednesday, September 12, 2001 3:47 PM

        To:     [log in to unmask]

        Subject:        Re: [TN] No-Clean Solder Paste



        Chris,

        I don't know if there is a good pro and con list for no-clean

assembly.

        You can look at IPC-TP-1115 "Selection and Implementation Strategy

for a

        Low Residue No-Clean Process" for a good list of things to consider

in such

        a switch.  I can send it to you if you like.



        Doug Pauls

        Rockwell Collins





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