Expert Technetters!

I'd value your opinions on the following.

My company is starting development of a new microelectronics device that
will be packaged in a new style of package. The substrate of the package
will be made from FR4 laminate - maybe 0.30mm thick. The package will have
two concentric rings of pads laid out something like this:

        _______________________________
        |  *   *   *   *   *   *   *  |
        |  *                          |
        |  *    *   *    *    *    *  |
        |  *    *             *       |
        |  *    *   *    *    *    *  |
        |  *                          |
        |  *   *   *   *   *   *   *  |
        |_____________________________|

I would have thought the obvious connection style would be BGA but my
manufacturing minded colleagues want to use plain flat Ni/Au pads.

Is this an acceptable design or are there issues with reliability, PCB
population etc?

Your opinions would be welcome.

Regards,



Eric Christison

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