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September 2001

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Subject:
From:
David Fish <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 13 Sep 2001 09:56:06 -0700
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Paul

Maybe you customer could consider the appropriateness of one of the
following IPC TM-650 procedures:
2.6.14A, Resistance to Electrochemical Migration, Polymer Solder Mask
2.6.14C, Resistance to Electrochemical Migration, Solder Mask
2.6.14.1, Electrochemical Migration Resistance Test

Dave Fish
----- Original Message -----
From: "tech" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, September 13, 2001 5:45 AM
Subject: [TN] Electro Migration Testing


> We're being asked to perform  electro migration testing on an ongoing
> basis on pcbs we produce. The test required is defined as follows:
> A drop of water (.5 Megohms/cm.) is dropped between 2 traces spaced .010
> apart and a current of 3V DC is applied. Current leakage of no more than
> 30 micro amps / thou of seperation /minute must be met ???
>  Is this a "standard" test and if so is a procedure defined anywhere (
> IPC , MIL. etc) ?  Is it typical to perform this as a routine QC check
> or is it the type of test normally performed as a qualification  test
> only ?
>  Any information on this would be much appreciated.
> Paul Greene
>
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