We're being asked to perform electro migration testing on an ongoing
basis on pcbs we produce. The test required is defined as follows:
A drop of water (.5 Megohms/cm.) is dropped between 2 traces spaced .010
apart and a current of 3V DC is applied. Current leakage of no more than
30 micro amps / thou of seperation /minute must be met ???
Is this a "standard" test and if so is a procedure defined anywhere (
IPC , MIL. etc) ? Is it typical to perform this as a routine QC check
or is it the type of test normally performed as a qualification test
only ?
Any information on this would be much appreciated.
Paul Greene
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