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September 2001

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Subject:
From:
Grant Emandien <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 13 Sep 2001 14:31:35 +0200
Content-Type:
text/plain
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text/plain (92 lines)
If this does not infringe any copyrights, please copy me as well.

Thanks Doug
Grant

-----Original Message-----
From: Bartkowaik Christine [mailto:[log in to unmask]]
Sent: Thursday, September 13, 2001 1:36 PM
To: [log in to unmask]
Subject: Re: [TN] No-Clean Solder Paste


Doug:

I would appreciate a copy.

        -----Original Message-----
        From:   [log in to unmask]
[SMTP:[log in to unmask]]
        Sent:   Wednesday, September 12, 2001 3:47 PM
        To:     [log in to unmask]
        Subject:        Re: [TN] No-Clean Solder Paste

        Chris,
        I don't know if there is a good pro and con list for no-clean
assembly.
        You can look at IPC-TP-1115 "Selection and Implementation Strategy
for a
        Low Residue No-Clean Process" for a good list of things to consider
in such
        a switch.  I can send it to you if you like.

        Doug Pauls
        Rockwell Collins


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