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September 2001

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Subject:
From:
"Marsico, James" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 4 Sep 2001 11:01:16 -0400
Content-Type:
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text/plain (72 lines)
This was probably referring to a filled via that was copper plated over the
top, resulting in what appears like a round, solid pad.  We use this design
quite often.

Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group
[log in to unmask] <mailto:[log in to unmask]>
631-595-5879



        -----Original Message-----
        From:   Rick Thompson [SMTP:[log in to unmask]]
        Sent:   Tuesday, September 04, 2001 10:40 AM
        To:     [log in to unmask]
        Subject:        [TN] Cap-plate Via-in-Pad??

        Hi,

        I was doing some reading over the weekend and came across a
reference I
        wasn't familiar with that said:
           "Note that a filled and cap-plate via-in-pad construction was
used".

        Can someone enlighten me as to what 'filled and cap-plate
via-in-pad' is?

        Thanks,


        Rick Thompson
        Ventura Electronics Assembly
        2655 Park Center Dr.
        Simi Valley, CA 93065

        +1 (805) 584-9858   x-304  voice
        +1 (805) 584-1529 fax
        [log in to unmask]


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