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September 2001

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Subject:
From:
Rick Thompson <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 4 Sep 2001 07:40:12 -0700
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Hi,

I was doing some reading over the weekend and came across a reference I
wasn't familiar with that said:
   "Note that a filled and cap-plate via-in-pad construction was used".

Can someone enlighten me as to what 'filled and cap-plate via-in-pad' is?

Thanks,


Rick Thompson
Ventura Electronics Assembly
2655 Park Center Dr.
Simi Valley, CA 93065

+1 (805) 584-9858   x-304  voice
+1 (805) 584-1529 fax
[log in to unmask]

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