With the electronic industry going more and more to lead free solder,
inspection/acceptance criteria on lead free solder has not been defined (or
if it has, I have not run across it yet).  Our company is leaning to
Sn96.3/Ag3.7. I have established internal acceptance criteria but am looking
for some industry criteria to use.  Lead free solder does not have the same
appearance as does tin/lead solder, so the old "shiny and smooth" critera
cannot apply.

Does anyone have any insight as to the criteria that needs to be applied?
Has the inspection/acceptance criteria been reviewed and established?
Is someone meeting and establishing this criteria?  Who from industry is
part of this committee?

Thank you,
Frank Parra
Q.A. Manager
Raltron Electronics

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