Larry,

Basic FR4 will take 500V per mil theoritically, but in
practical i have used 500 volts design with 25V per
mil gap, ie. use 20 mil space and avoid sharp bends in
the design. strictly provide solder mask and make
provision for electrostatic shielding. Do not try to
create a potential difference of 500 v between
layers(if it is multiu layer) , I prefer DSBs are
better here. Advice the assembly fabricator to put
conformal coat on the assembled board.(polymer coat to
protect the PCB from moisture absorption and protect
the operators/service engineers/ polymer coat will be
very good if the card is going to function in high
humidity environment.).
Regards
James M Paul
PCB Design Engineer.
ISRO Satellite Centre, Bangalore, INDIA.

--- Randy McHugh <[log in to unmask]> wrote:
>
Larry,
>
> Some things to consider are:
> 1.) Thickness/gap of the traces, your conductor
> width is driven by current, the gap by the voltage.
> 2.) Filling vias. If you have high current with your
> voltage you may have to fill large diameter vias
> with solder.
> 3.) External covering of the board. Is it just
> solder mask or are you conformally coating the
> board?
> 4.) AC or DC voltage noise. If the high voltage
> trace is generating alot of noise you will need to
> shield it.
> 5.) You shouldn't have to use different substrate
> unless you want to heat up the trace by using a
> small width.
>
> Good luck,
> Randy McHugh
>
> -- >>  Anyone out there have any experience with 500
> volts on a printed circuit
> -- >>  board?  What design considerations have to be
> considered?  Different
> -- >>  board
> -- >>  materials?  Looking for some guidance or
> references.
>
> -- >>  Larry L. Pucket
> -- >>  [log in to unmask]
>
> -- >>
>
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>
>
>
>
>
> Randy McHugh
> Optimum Design Inc
> 266 Corporate Dr
> Madison, WI 53714
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