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Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 10 Sep 2001 08:42:03 -0500 |
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Hi folks! The 003 PWB solderability committee would welcome the
re-activation of a wetting balance users task group! Most of the wetting
balance test procedures currently in the specification are the results of
the previous task groups efforts. One change to Neil's idea - a
specification and/or test procedure should not be "equipment" specific. The
wetting balance equipment vendors and the wetting balance equipment users
teamed together in the last task group effort to make the test method as
"equipment insensitive" as possible. I will put the topic on the committee
agenda during the Fall meeting in Orlando.
Dave Hillman
003 Committe Chair
[log in to unmask]
ngmurray <[log in to unmask]>@IPC.ORG> on 09/08/2001 04:03:07 PM
Please respond to "TechNet E-Mail Forum." <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
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cc:
Subject: Re: [TN] Wetting Balances
Great idea. We use the RPS Six sigma, unfortunately. Perhaps we should
structure three different user groups under Hillman's committee, one for
each of the most commonly used wetting balance testers. We are currently
doing a lot of development based upon wetting balance analysis and are
encouraging our PCB and component suppliers to make more active use of
wetting balance in their solderability testing.
Neil Murray
Technical Specialist, Component Engineering
TRW OSS
248-442-8428
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Bev Christian
Sent: Friday, September 07, 2001 2:55 PM
To: [log in to unmask]
Subject: [TN] Wetting Balances
I've been talking to the fellows at ACI/EMPF and we have decided we would
like to form a users group for the MUST System II Wetting Balance.
I guess what I would like to see would be the following:
1) Have multiple sources of advice for little problems
2) Share info on the test parameters for new and/or weird parts. For
example, how do you hold a 0201 in a clip made for 0805's? How do you
hold a thumbwheel?!! How deep do you immerse some of these wonderfully
designed components that only have solderable surfaces on the vertical side
of the part! GRRRRRR! I think you get the picture.
3) Champion using globule testing as opposed to a full solder bath dip.
4) Act as resource for the IPC 5-23a Task Group (J-003) and IPC 5-23b Task
Group (J-002), if Dave Hillman and company are willing to have us. :)
5) Apply persuasion, if it becomes necessary, with regards to service as
the Multicore/Loctite/Henkel transition continues.
Note, anyone is of course able to form a similar group for other wetting
balances and we aren't making any claims one way or the other here about
the equipment in question.
So, if you are interested, phone or e-mail me.
regards,
Bev Christian
Materials Engineering Lab Manager
Research in Motion
519-888-7465 x 2468
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