Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 4 Sep 2001 09:34:05 -0500 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
With the electronic industry going more and more to lead free solder,
inspection/acceptance criteria on lead free solder has not been defined (or
if it has, I have not run across it yet). Our company is leaning to
Sn96.3/Ag3.7. I have established internal acceptance criteria but am looking
for some industry criteria to use. Lead free solder does not have the same
appearance as does tin/lead solder, so the old "shiny and smooth" critera
cannot apply.
Does anyone have any insight as to the criteria that needs to be applied?
Has the inspection/acceptance criteria been reviewed and established?
Is someone meeting and establishing this criteria? Who from industry is
part of this committee?
Thank you,
Frank Parra
Q.A. Manager
Raltron Electronics
---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------
|
|
|