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September 2001

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From:
"Marsico, James" <[log in to unmask]>
Date:
Wed, 26 Sep 2001 15:44:57 -0400
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"TechNet E-Mail Forum." <[log in to unmask]>
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Ok... Here we go again.  We are experiencing solder beads found UNDER chip
components.  The following questions are for all SMT assemblers (this info
would be very helpful to me):

1)      Do you look for solder balls under chip devices?
2)      Do you find them?
3)      Do you rework this anomaly?
4)      What workmanship criteria are you working to (i.e. MIL-STD-2000,
IPC-610, other)?

Thanks in advance,
Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group
[log in to unmask] <mailto:[log in to unmask]>
631-595-5879

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