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Wed, 26 Sep 2001 15:44:57 -0400 |
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Ok... Here we go again. We are experiencing solder beads found UNDER chip
components. The following questions are for all SMT assemblers (this info
would be very helpful to me):
1) Do you look for solder balls under chip devices?
2) Do you find them?
3) Do you rework this anomaly?
4) What workmanship criteria are you working to (i.e. MIL-STD-2000,
IPC-610, other)?
Thanks in advance,
Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group
[log in to unmask] <mailto:[log in to unmask]>
631-595-5879
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