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Thu, 13 Sep 2001 07:35:31 -0400 |
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Doug:
I would appreciate a copy.
-----Original Message-----
From: [log in to unmask]
[SMTP:[log in to unmask]]
Sent: Wednesday, September 12, 2001 3:47 PM
To: [log in to unmask]
Subject: Re: [TN] No-Clean Solder Paste
Chris,
I don't know if there is a good pro and con list for no-clean
assembly.
You can look at IPC-TP-1115 "Selection and Implementation Strategy
for a
Low Residue No-Clean Process" for a good list of things to consider
in such
a switch. I can send it to you if you like.
Doug Pauls
Rockwell Collins
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