Hi Gary! I presented a paper at the IPC EXPO 2001 conference which
described a class 3 use environment application of the 43/43/14 alloy which
will provide some data you are trying to find. The Tin Research Institute
may also have some data on the 43/43/14 alloy in its files. Good luck. If
you have any additional questions just send me an email.

Dave Hillman
Rockwell Collins
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Gary Bremer <[log in to unmask]>@IPC.ORG> on 08/25/2001 08:27:25 PM

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Subject:  [TN] Bisumth Solder (Sn43Pb43Bi14)


Can anyone tell me what the properties of Bi14 solder is?

Joint Strength ==>
Fatigue Resistance ==>
Yield Strength ==>
High Temperature Life ==>
Solder Joints Hardness ==>
Intermetallic Growth Rates ==>
Ultimate Tensile Strength ==>
Percent Elongation ==>
Adaptability to Stress ==>
Thermal Fatigue Properties ==>
Thermal and Electrical Conductivity ==>
Imtermetallic compounds formed ==>

Could this solder be used in a high reliabilty (class 3) application?
The application I have is a unit that is subjected to temperatures from -
40° to + 70° Celsius, vibration of 6G.  So far I have conflicting opinions,
I need some facts and data.  I teach soldering and have not heard of anyone
using this solder within the electronic industry.  I check with the
soldering instructors at China Lake and they had not heard of this solder.

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