I have a question in regard to the electrical conductor spacing chart in
2221.
I am about to design a board with up to 300V operating and tested to 2000V.
For 2000V on an internal conductor I calculate a spacing requirement of 4mm
or .150in. This spacing would remove all copper off my planes.
So I ask if we could consider the final product as "homogeneous" after
lamination?
If the FR4 I use (/21) has an electrical strength of 1140V per mil could I
not in theory reduce my spacing considerably? Would it not be similar to
the Layer to Layer spacing?

Also, is there a formula that I can use to determine spacing with a time
variable included? I understand the testing is measured in milliseconds.

Thanks for any help,

Dave Calderone
JDS Uniphase
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