Good day Technetters,

I am having some difficulty in deciding what acceptance/rejection criteria
to apply when it comes to the registration of laser drilled microvias in the
centres of uBGA pads. For your information the design has uBGA pads 0.3mm
dia with microvias is approx 0.12mm (finished) in the centre of each. The
nearest I can find is referred to in IPC-A-600 ref. F section 2.10.3. Would
Technetters agree that these criteria should be applied regardless of the
technique used to manufacture the PCB or is there other guidance specific to
this particular type of technology that you could refer me to?

Regards,

Peter Barton
ACW Technology Limited

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