We had this design and did not like it despite of fact it saved a lot of PBB
space. Problem was , especially for small chip packages ( 0603) that volume
of vias barrel is comparable to volume of solder joint and this vias was
"steeling" solder from solder joint accidentally ( during wave soldering).
Result  - insufficient  or even missing solder joint.

We do not have this layout  design anymore ..

Regards

Vit Sklenar MGE4VS
T: (61 3)9541 7734  F: (61 3) 9541 3909
e-mail work:   [log in to unmask]
e-mail home:  [log in to unmask]
> Robert Bosch (Aust) ,
1555 cnr.Centre and McNaugton Road,
> Clayton , VIC 3169, Australia
>
>
> -----Original Message-----
> From: Ken Patel [SMTP:[log in to unmask]]
> Sent: Thursday, August 09, 2001 4:53 AM
> To:   [log in to unmask]
> Subject:      [TN] VIAS in pads...
>
> Assemblers,
> How robust is the VIA in the pad technology now? Can someone share the
> process of handling board that has vias in pads?
>
> Most of our boards have VIAS in the pads and there is no way out.
>
> re,
> Ken Patel
>
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