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August 2001

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Subject:
VIAS in pads...
From:
Ken Patel <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 8 Aug 2001 11:52:35 -0700
Content-Type:
text/plain
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Assemblers,
How robust is the VIA in the pad technology now? Can someone share the
process of handling board that has vias in pads?

Most of our boards have VIAS in the pads and there is no way out.

re,
Ken Patel

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