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August 2001

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Subject:
From:
Karen Walters <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 8 Aug 2001 14:39:59 -0400
Content-Type:
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I am trying to solve the problem of cracking inside a printed
circuit board due to moisture absorption, temperature in the oven and the
thermal gradient observed on the board.  After the drying process, the
boards are left outside
in the manufacturing area, but due to the environment they are absorbing
moisture again.  I would like to know which products would fit better(sealed
bags,vacuum bag,with/without desiccant,low humidity or nitrogen filled
storage cabinets...).  Also has anyone done a study on moisture absorption
in a PCB under different environment conditions, and baking requirements for
different environmental conditions?
If you have any data, please advise.





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