Hello Guys,
We were encountering RDS (Resistance to Drain and Source) fall-outs
after Power Cylce (PRCL- 5K Cylcles).
All tests passed (TMCL, HAST, HTRB, HTGB) except this PRCL test.
The failure was the On resistance of the device which is already above the
limits required
by the Specs (but the device still functional).
Does anybody out there experinced this kind of fall-outs?
Would you agree that die attach voids could be a factor of the RDS
fall-outs?
But why not during prime class testing? And not fail during TMCL?
Or are there any experience that more than 10 % voids can cause failures
on Electrical performance?

I hope you can share your experiences

God Bless You All
thanks

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