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Subject:	Re: Pre assembly conditioning
From:	Jack Crawford <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Fri, 31 Aug 2001 21:10:56 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (37 lines)

IPC-PE-740 has some info on bakeout of bare boards, and you'll also find some support info in IPC-HDBK-001.  Not extensive in either, but some recommended times/temperatures in HDBK-001 particularly.  For those that aren't aware, HDBK-001 was updated extensively last year to include an excellent comparison of the B to C versions.

Cordially,
Jack Crawford
IPC Director of Assembly Standards and Technology

>>> [log in to unmask] 08/31/01 13:36 PM >>>
Hello,
I appreciate this source so much.
I am wondering if anyone can lead me to the standard and section that
deals with conditioning of bare boards before assembly for moisture
retention? Does such a requirement exist? Is there somewhere in a
standard that puts a limit on how long boards can be kept before
conditioning is required, and how bare fabs are required to be stored?
Thank you in advance.
kb

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