Hello,

Does anyone have experience in determining the root causes for hi-pot
test failures?

I am especially interested in the effect of flux residues remaining from
no-clean hand soldering. The DUTs are being screened with a 3KV, 10sec
hi-pot tester. So far my results are inconclusive as to whether the flux
seen on the board has any influence on the test results.


Rgds,
Peter



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