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Subject:	Re: Contamination Concern after Strip
From:	"Crepeau, Phil" <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Tue, 7 Aug 2001 07:30:11 -0700
Content-Type:	text/plain
Parts/Attachments:	text/plain (49 lines)

hi,

you might look into plasma etching.  if your board fabricator uses this process for hole cleaning, they may be able to do this for you.  cleanliness could be determined by running some wire bond tests on the panel before you start the real wire bonding.

phil

-----Original Message-----
From: Bill Christoffel [mailto:[log in to unmask]]
Sent: Tuesday, August 07, 2001 6:04 AM
To: [log in to unmask]
Subject: [TN] Contamination Concern after Strip

Input Needed !

We currently use a board that is designed for gold ball bonding (COB)
and have specified  electroplated gold as the top metal layer.  This
board also uses a Tayio solder mask material that is flood coated over
the top, including the gold pads then photo imaged/etched. to expose
specific gold pads for wire bonding.    My concern is that the solder
mask may be leaving some type of contamination on the bonding pads.   If
so, I'm looking for recommendations on how to verify cleanliness, other
than ionically (which we do) and how to remove any contamination.

Thanks,

Bill C.

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