Claude,
if I understood your question properly on fine pitch packages you are better
off
not using solder mask and also try to offset the paste mask by .005""
towards the outside of
component placement.



Shahed Safavi-Bayat, C.I.D.
Cad Designer

1035 Greenwood Blv. Suite 173
Lake Mary Fl 32746
mailto: [log in to unmask]
Tel : (407)829-4440 ext.216
Fax : (407)829-2213



-----Original Message-----
From: Claude Tremblay [mailto:[log in to unmask]]
Sent: Wednesday, August 29, 2001 4:56 PM
To: [log in to unmask]
Subject: [TN] HASL


Hi

I have a question about HASL. Is there any standard or specs about SMT land
to land height variation? We received some PCB with poor HASL coplanarity
and I suspect that it is the reason for my problems (shorts and open
joints) on my 0.5mm fine pitch.

Can you provide me with some info?

Regards

Claude Tremblay
Process Engineering Supervisor

C-MAC
Laval Electronic System Division
2185 Michelin, Laval, H7L 4S2
Quebec, Canada
Tel: 450-978-5000 ext. 3335
Fax: 450-978-3237
E-mail: [log in to unmask]

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