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August 2001

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Subject:
From:
Brian Ellis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 30 Aug 2001 09:40:10 +0300
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Mark,

IMHO, there will be no problem as long as the underlying copper was
correctly prepared before hassling it. Your spec. allows a good
tolerance beyond the limits.

Brian

Mark Hargreaves wrote:
>
> Hi All,
> Our most recent HAL solder analysis report showed tin at 61.17%  (report
> spec is 61.5 - 63.5) and gold at 0.055% (report spec is 0.045%).
> We're replacing the solder, but I'm wondering about the solderability of
> boards that have already been processed.  Will these levels not, possibly,
> or certainly cause soldering problems?
>
> Thanks,
> Mark
>
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