Hello Rick,
     In my previous company we are doing oven bake with weights to straighten out the warp substrate (laminates).

regards,
greg





Rick Howieson <[log in to unmask]>@IPC.ORG> on 08/28/2001 11:36:00 PM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>

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To:     [log in to unmask]
cc:      (bcc: Gregorio M Antonio/CUB/SC/PHILIPS)
Subject:  [TN] BGA Bow
Classification:


We have a BGA that is twisted. The substrate appears to be polyimide. Is
there an efficient way to remove the twist/bow.
Thanks,
Rick Howieson
Delta Group Electronics

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