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August 2001

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Subject:
From:
"Busko, Wolfgang" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 27 Aug 2001 10:18:27 +0200
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Hi all,
 
I got some new pictures on Steveīs page
http://stevezeva.homestead.com/index.html
<http://stevezeva.homestead.com/index.html>  .
They show an interesting phenomenom that obviously occurred during Ni/Au
plating.
These "pimples" and "pumples" at the base of the metallic structure right on
the FR4 surface that surround the pads look like miserable paintwork, yanno,
like if you paint your  windowframes yourself.
Has anybody seen something similar before and what could have caused that
and what would you think would be the risk if we use those boards.
 
We have to come to a quick decision and canīt afford to wait for a
laboratory result.
 
Thanks in advance 
 
Wolfgang
 

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