Hi,

I had Steve put a picture on his web-site.


Go to: <http://stevezeva.homestead.com/>
Labeled "Connector footprint"
Sorry for the picture not being a closer look.  Hopefully you'll understand.


In this picture, you will see the leftovers of me removing a 41 position
connector with pliers.  What I was trying to do was see what kind of solder
connection I had.  I wasn't sure what was going to happen when doing this,
but what you see in the picture is that most of the pads came away from the
substrate with the connector leads, and 14 positions had solder left behind
that looked porous.  Before I removed the connector, all 41 positions had
evidence of wetting from the pad up the sides of the leads.  I had some
doubt of the joint because the solder did not show as good of a wetting
action between the pad and the toe of the lead (by the way, this is a
gull-wing style).  We use IPC class II inspection criteria.  This same board
passed our electrical continuity test.

Questions:

1. Does pulling of the connector tell me anything about the inner-metallic
bond between the lead and pad?
2. Is this a fair way to determine the bond?
3. Because the left over joint looked porous, does this mean the solder did
not flow completely? Or, did the pulling of the lead away from the pad cause
the porous look?


I'm just trying to determine if I have a good joint, but we don't have any
way of verifying the joint except by using the IPC guidelines.

Thanks for your help!
Jim

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