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August 2001

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Subject:
From:
"Lambert, Katherine A." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 23 Aug 2001 11:59:38 -0400
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Hi folks,

We're embarking on something new.  We will be assembling boards with BGAs.
Some are small and fine pitch, others are regular pitch but quite large
(40mm square).  We will be underfilling them with adhesive.  Because we're
underfilling, we have to clean the flux from underneath the parts.  We're
using an RMA flux based solder paste.

Now for the question - how should I clean the flux from under these parts?
Any clues as to which solvent to use?  Any ideas on what type of equipment
to use?  I have at my disposal an in-line semi-aqueous cleaner and a vapor
degreaser.

Thanks for any insight.

Kathie Lambert
Process Engineer
Northrop Grumman
Baltimore, MD
410-765-9746

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